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NC-559-ASM 100g Lead-Free Solder Flux Paste For SMT BGA Reballing Soldering

$ 5.26

Availability: 100 in stock
  • Model Number: 559
  • Restocking Fee: No
  • Condition: New
  • MPN: Does not apply
  • Brand: XMSJ
  • Item must be returned within: 30 Days
  • Refund will be given as: Money Back
  • Origin: CN(Origin)
  • Return shipping will be paid by: Buyer
  • All returns accepted: Returns Accepted
  • Particle Size: 1-10μm

    Description

    High quality lead free solder fusing paste, free shipping, NC-559-ASM, 100g, for  BGA repair solder repair
    Model: NC-559-ASM
    Volume: 100 g/bottle
    It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and for mounting operations such as pulling Chip attachment to PCB substrates. It is a necessary and useful tool in BGA repair.
    Feature::
    Excellent welding adhesion ability
    Excellent anti-humidity capability
    Widely used in BGA, PGA, CSP packages and flip chip operation
    Suitable for multiple PCB reflux
    Non-clean and lead free for environmental protection